Pigment paste systems

 

Printing ink systems for rubber sheet

 

Lacquers and effects for plastic and metal parts

 

Lacquer system for toys

 

Release agent for PU and Rubber Industries

     

 

 

 

In-Mould-Coating Systems (IMC)

It is applied in coloring, decoration and protection of PU foam parts. These lacquer systems is applied for the mould spraying, back-injection forming technology. It integrated In-Mould-Coating film to the forming substrates and offers effectively UV resistance for PU foams parts, as well as enhancing the surface abrasion resistance performances and colorfastness. IMC can also cover the imperfect surface appearances caused by foaming processes such like foam line etc. The excellent quality of the lacquer systems ensures the finest original mould surface texture.

IMC simple the coating process greatly and reduces the over-spraying wastes , resulting in improving production efficiency and consequently reduction of production cost.

In addition, tailor-made products can be supplied according to customers' different requirements - particularly on UV resistance, abrasion resistance, chemical resistance and color effects.


 

BOMEX IMC Lacquer Systems are classified:
  Solvent -based 2 Component System
   
Suitable for rigid, semi- rigid, integral, flexible foam and RIM process etc;
  Solvent -based 1 Component System
    Suitable for rigid, semi-rigid, integral, flexible foam etc;

  Kinlix ® Water -based System
   
Suitable for different foams systems, particularly for In-Mould-Skinning (IMS) process.

 

BOMEX IMC Lacquer Systems are applied in:
  Automobile parts;
  Furniture;
  Sports and healthcare equipments ;
  Building materials;
  Toys

 

Surface Finishing Lacquer Systems
This lacquer system can spray directly on PU foaming parts, and also can be applied as finishing lacquer. They have very good UV, abrasion, alcohol resistance and demonstrate good adhesion.

Colors and effects can be tailor made upon requests.

The systems can be used widely in different PU foam systems and processes.